|FLAG-Era III JCT2024 https://www.flagera.eu/flag-era-calls/flag-era-joint-transnational-call-jtc-2023/jtc-2023-funded-projects/
|2D-Paper Thermally conducting paper substrates
|Engineering sciences and technologies: Textile and leather
|1. 1. 2024 – 31. 12. 2026
|300.000 EUR (MVZI)
|Prof. Dr. Vanja Kokol https://cris.cobiss.net/ecris/si/sl/researcher/8756
|Linköping University https://liu.se/en/employee/xavcr43
Stockholm University https://www.su.se/english/profiles/maji-1.227005
ParsNord Thermoelectric Filial https://www.parsnord.dk
IMRA Europe https://www.imra.eu/imra.eu/
|The existing traditional synthetic polymer substrates used in the production of flexible electronics (printed circuits) are thermal insulators, which accumulate the heat produced by the resistance of printed Si-chips/processors with the Joule effect; this affects the operation of the device and shortens its lifetime. Traditional active cooling methods are usually not compatible with flexible electronics, and also consume additional energy.
The project will thus examine the possibility of producing cheap, green and recyclable electrically insulating and thermally conductive flexible paper substrates using inorganic 2D nanoparticles (graphene and hexagonal boron nitride/h-BN) and cellulose nanofibrils (CNF), which will ensure robustness, mechanical stability and additional cooling effect by desorption of accumulated moisture/water. We will examine the influence of the chemical and morphological structure of substrates produced by various industrially relevant technological processes (vacuum filtration, one-way freezing, surface coating using slot-die, screen-printing or spraying, TRL 1-4) on the ability to transfer heat and the way which will meet the technical specifications (flexibility, robustness, surface flatness, low expansion factor, minimal swelling, insolubility in water and organic solvents, good mechanical and thermal stability) required in the production of flexible electronics and for various applications (wearable electronics, smart products in healthcare /medicine, security/packaging, foldable opto/electronics, etc.). We will use artificial intelligence to optimize the dielectric, thermal, and optical properties of substrates, and perform LCA analysis.
The newly developed substrates will be cost-effective, environmentally friendly, and easily recyclable with a smaller amount of waste. They will also be an effective alternative to expensive and environmentally harmful traditional hard ceramic substrates, enabling their use in thermoelectric heating and cooling modules without hazardous cooling systems.
|Specific phases and stage of realization
|(i) Mix CNF and h-BN through scalable water-based dispersion, and investigate the addition of graphene oxide into such nanocomposite.
(ii) Fabricate the free standing and homogenous h-BN/CNF (GO/h-BN/CNF) nanocomposite substrates (30-100 μm thick) through scalable dewatering strategies.
(iii) Ensure high dielectric performance and high thermal conductivity.
(iv) Explore the additional effect of cooling via the evaporation of absorbed water.
(v) Form a transparent and mechanically strong / flaxable paper with good chemical resistance.
(vii) Recycle CNF and GO/h-BN by easy separation.